USB 4.0 은 공식적으로 썬더볼트3 포함

 

 

DEVELOPER UPDATE 

CONTACTS: Brad Saunders  

USB Promoter Group  

+1 503-264-0817 

brad.saunders@intel.com

 

Joe Balich

USB-IF PR

+1 503-619-4113

press@usb.org 

 

USB Promoter Group Announces USB4 Specification 

Specification defines next generation USB protocol architecture and doubling bandwidth to extend USB Type-C™ performance 

 

Beaverton, OR, USA – March 4, 2019 – The USB Promoter Group today announced the pending release of the USB4 specification, a major update to deliver the next generation USB architecture that compliments and builds on the existing USB 3.2 and USB 2.0 architectures. The USB4 architecture is based on the Thunderbolt™ protocol specification recently contributed by Intel Corporation. It doubles the bandwidth of USB and enables multiple simultaneous data and display protocols. 

 

The new USB4 architecture defines a method to share a single high-speed link with multiple end device types dynamically that best serves the transfer of data by type and application. As the USB Type-C™ connector has evolved into the role as the external display port of many host products, the USB4 specification provides the host the ability to optimally scale allocations for display data flow. Even as the USB4 specification introduces a new underlying protocol, compatibility with existing USB 3.2, USB 2.0 and Thunderbolt 3 hosts and devices is supported; the resulting connection scales to the best mutual capability of the devices being connected. 

 

“The primary goal of USB is to deliver the best user experience combining data, display and power delivery over a user-friendly and robust cable and connector solution,” said Brad Saunders, USB Promoter Group Chairman. “The USB4 solution specifically tailors bus operation to further enhance this experience by optimizing the blend of data and display over a single connection and enabling the further doubling of performance.”

 

Key characteristics of the USB4 solution include: 

 Two-lane operation using existing USB Type-C cables and up to 40 Gbps operation over 40 Gbpscertified cables 

 Multiple data and display protocols to efficiently share the total available bandwidth over the bus 

 Backward compatibility with USB 3.2, USB 2.0 and Thunderbolt 3 

 

With over 50 companies actively participating in the final stages of review of the draft specification, the USB4 specification is on track to be published around the middle of 2019. Coincident with the release of the USB4 specification, the release of an updated USB Type-C Specification will be made to comprehend USB4 bus discovery, configuration and performance requirements.

 

USB Developer Days 2019, in the second half of this year, will include detailed technical training covering the USB4 specification and the latest for USB Type-C, USB Power Delivery, and other exciting topics. 

 This update is part of the USB performance roadmap and is specifically targeted to developers at this time. Branding and marketing guidelines will be established after the final specification is published.  

 

“Releasing the Thunderbolt protocol specification is a significant milestone for making today’s simplest and most versatile port available to everyone,” said Jason Ziller, General Manager, Client Connectivity Division at Intel. “By collaborating with the USB Promoter Group, we’re opening the doors for innovation across a wide range of devices and increasing compatibility to deliver better experiences to consumers.”

 

“USB4’s high throughput and advanced features enable new scenarios in consumer, enterprise, and intelligent edge markets, while maintaining interoperability with existing USB and Thunderbolt 3 devices,” said Roanne Sones, Corporate Vice President, Microsoft OS Platforms. “We are excited to work with our partners in the ecosystem to bring USB4 to market and showcase its benefits.”

 

About the USB Promoter Group The USB Promoter Group, comprised of Apple Inc., Hewlett-Packard Inc., Intel Corporation, Microsoft Corporation, Renesas Electronics Corporation, ST Microelectronics, and Texas Instruments, continues to develop the USB family of specifications to meet the market needs for increased functionality and performance of USB solutions. Additionally, the USB Promoter Group develops specification addendums (USB Power Delivery, USB Type-C™, and others) to extend or adapt its specifications to support more platform types or use cases where adopting USB technology will be beneficial in delivering a more ubiquitous, richer user experience. 

 

About the USB-IF The non-profit USB Implementers Forum, Inc. was formed to provide a support organization and forum for the advancement and adoption of USB technology as defined in the USB specifications. The USB-IF facilitates the development of high-quality compatible USB devices through its logo and compliance program, and promotes the benefits of USB and the quality of products that have passed compliance testing. Further information, including postings of the most recent product and technology announcements, is available by visiting the USB-IF website at www.usb.org. 

 

USB Type-C™ and USB-C™ are trademarks of USB Implementers Forum. Thunderbolt™ is a trademark of Intel Corporation. 

 

 

 

 

20여년 만에 드디어 USB 하나로 디스플레이는 물론 모든 장비를 사용할 수 있는 시대가 온다.

 

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https://www.bodnara.co.kr/bbs/article.html?num=153189

인텔은 USB 프로모터 그룹(USB Promoter Group)에 인텔 썬더볼트 프로토콜 사양을 공개해 다른 칩 제조사들이 썬더볼트에 호환되는 실리콘을 로열티 없이 개발할 수 있도록 지원한다고 발표했다.

 

이와 함께 USB 프로모터 그룹은 썬더볼트 프로토콜에 기반한 USB4.0 사양을 공개했다. 근간이 되는 썬더볼트 및 USB 프로토콜의 융합은 USB Type-C 커넥터 기반 제품간의 호환성을 향상해 소비자들의 디바이스 연결 방식을 단순화할 것이다.

인텔은 앞서 썬더볼트3를 향후 인텔 CPU에 통합하고 썬더볼트 프로토콜 사양을 업계에 공개한다는 계획을 공유한 바 있다. CES 2019에서 발표된 바와 같이 인텔의 출시 예정 10nm 프로세서인 코드명 '아이스 레이크(Ice Lake)'는 썬더볼트3를 통합한 첫 제품이 될 것이다. 인텔은 USB 4.0 및 프로세서와의 통합을 통해 썬더볼트의 대규모 메인스트림 도입을 가속화할 것으로 기대를 나타냈다.

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